Industrial Memory & Peripherals
Solid State Disks Ltd
We are pleased to be working closely with a number of leading memory manufacturers, enabling us to supply a wide range of products for embedded and industrial applications.
Engineering in today’s economic climate is all about finding the perfect balance between performance and cost – and that’s certainly the case when it comes to memory selection.
Thanks to our extensive practical experiences, we can help you make the right choices.
Visit our Product Selector tool to view our extensive range (you’ll be impressed) and then connect with us so that we can advise on prices and timeframes, and answer any questions you might have.
The gold standard for NAND Flash remains single-level cell (SLC) technology, which gives the highest speed for read and write operations.
However, with only a single bit of data stored per cell, SLC tends to be the most expensive technology because of the silicon real estate required.
More than one bit can be stored in each cell under the following Flash technologies: multi-level cell (MLC aka dual-level cell, DLC – two bits), triple-level cell (TLC – three bits), quad-level cell (QLC – four) and penta-level cell (PLC – five).
Also, under MLC and TLC, 3D NAND stacks can be created. The ability to store more than one bit per cell, and to create stacks, makes better use of silicon real estate and thus reduces costs.
There is a trade-off though. Read/write access is slower. Also, memory wear increases the more bits stored per cell. That said, many manufacturers are using proprietary technologies to combat both effects and to deliver performance close to that of SLC.
Which technology is best for you? It will depend on your application and budget. For instance, if speed is not a top priority and you want the memory to last a long time, going for an MLC or TLC device with a larger capacity than you require might be the way to go (as it gives the wear-levelling function greater freedom). But there are all things we can advise on.
Another option, again driven by your application, is to combine Flash with DRAM. Again, we’re happy to advise.
Non-volatile memory, such as Flash, that can be easily removed from an embedded system or industrial application is, of course, vulnerable to data theft and other security threats.
Thankfully, there are ways of minimising the risk of data theft or compromised security, and we can advise on encryption, write protection and fast erase.
We supply JEDEC-compliant dynamic random-access memory (DRAM) modules that are a perfect fit for gaming, point of sale (POS), kiosk, medical and automation applications.
We have an extensive product line, ranging from legacy, industrial-grade SDRAM, and DDR1 solutions to latest technology solutions, such as SODIMM DDR4 2666MT/s modules. Form factors include dual in-line memory module (DIMM), long-DIMM, small outline DIMM (SODIMM) and very low profile (VLP). Capacities range from 128MB to 32GB.
Capacities from 128MB to 32GB. We supply server memory that delivers high performance and work toward a full fan-less design with compact design and low power requirements. They are available in long-DIMM, SODIMM and MiniDIMM form factors.
Capacities from 1 to 32GB. We offer DRAM made for harsh environment applications (in which extreme temperatures and/or rapid thermal cycling are common). Our solutions are perfect for use in vehicles, outdoor kiosks and military and aerospace applications. All modules surpass the JEDEC standard and are certified for operation across the temperature range -40 to 85°C. They are available in LongDIMM, SODIMM and MiniDIMM form factors.
We can also supply DRAM modules that a customised (with special characteristics) to meet the requirements of a specific application. For example, our XR-DIMM – which is available as DDR3 or DDR4 – is designed for the mission-critical military and aerospace applications.
Contact us to discuss, in complete confidence, your exact requirements. We’ve been doing what we do since the late 1980s and have a wealth of experience.
We offer a broad selection of embedded peripherals, such as the Intel® Movidius™ Myriad™ X Vision Processing Unit, which supports the Intel OpenVINO™ toolkit and is ideal for a wide variety of AI-enabled edge computing platforms. M.2 2280 B and mace form factors are available.
For communication systems, we offer I/O expansion cards that provide stable connectivity and bandwidth. These are ideal for industrial systems using PoE, CANbus, LAN and DIO, for example. Serial cards are available in form factors such as Mini PCIe, PCIe and M.2.
J1939-standard CANbus expansion cards are available for Windows-based systems (and Linux, through a SocketCAN implementation).
Our GbE LAN network cards support I210 specifications. These cards provide reliable RS232, RS422 and RS485 expansions. Available form factors include M.2 2280 B-M, mPCle, M.2 2260/2280 B-M, M.2 2242-B-M, M.2 2280 and Standard PCle.
We also offer storage expansion cards for Mini PCIe and M.2 SATA. Available form factors include M.2 2260/2280 B-M, mPCle, M2.3042-B-M.
Industrial-grade disk array cards give easy access to hardware-built RAID through data striping and mirroring and provide a RAID management system that ensures data integrity for embedded systems. These I/O expansion cards are offered in mini PCIe and M.2 SATA interface modules. Form factors are mPCle and 2.5-inch SSD.
Display Modules Featuring 2D graphics engines with resolutions up to 1920 x 1080 and with support for both Windows and Linux operating systems, Mini PCIe display cards are suitable for a wide variety of industrial platforms. Form Factors M2.2280 B-M and mPCle.
Also, through our principals, we can provide flash storage with different interfaces and in different form factors. We can also design and supply a signal converter for testing purposes, enabling you to test different types of embedded flash modules with one card.
Contact us with your specific requirements.