MTE760T & MTE760T-I

Transcend’s M.2 SSD MTE760T is a self-encrypting drive (SED) that complies with the TCG Opal 2.0 standards. Data is protected using the hardware-based AES 256-bit encryption and LBA (Logical Block Address)sector-specific permissions.

Transcend’s MTE760T features the 112-layer 3D NAND flash, a high-speed PCI Express (PCIe) Gen4 x4 interface, and a powerful controller, achieving never-before-seen transfer speeds. In addition, the 30µ” gold finger PCB, Corner Bond technology, and anti-sulfur resistors guarantee its reliability in harsh conditions. Transcend’s MTE760T is also 100% chamber tested in-house for extended operating temperatures of -20℃~75℃.

Transcend also offers the MTE760T-I with wide temperature (-40℃~ 85℃) capabilities to ensure sustained functionality, enhanced endurance and optimal reliability in mission-critical applications.

Order Information – Please Contact Us

256GB

TS256GMTE760T
TS256GMTE760T-I

512GB

TS512GMTE760T
TS512GMTE760T-I

1TB

TS1TMTE760T
TS1TMTE760T-I

2TB

TS2TMTE760T
TS2TMTE760T-I

Enquire Datasheet

Part Number:

TS2TMTE760T

Features

Firmware Features

Supports NVM command
Dynamic thermal throttling
Built-in LDPC ECC (Error Correction Code) functionality
Advanced Global Wear-Leveling and Block management for reliability
Advanced Garbage Collection
Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
TRIM command for better performance
NCQ command for better performance
Full drive encryption with Advanced Encryption Standard (AES)
Compliant with TCG Opal specifications and IEEE 1667 standards
Power-saving DevSleep (Device Sleep) mode (optional)

Hardware Features

Compliant with NVM Express specification 1.4
Compliant with PCI Express specification 4.0
Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
PCIe Gen 4 x4 interface
Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
Key components fortified by default with Corner Bond technology
30µ” PCB gold finger
Anti-sulfur technology implemented to prevent sulfurization in the environment
Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available

Firmware Features

Supports NVM command
Dynamic thermal throttling
Built-in LDPC ECC (Error Correction Code) functionality
Advanced Global Wear-Leveling and Block management for reliability
Advanced Garbage Collection
Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
TRIM command for better performance
NCQ command for better performance
Full drive encryption with Advanced Encryption Standard (AES)
Compliant with TCG Opal specifications and IEEE 1667 standards
Power-saving DevSleep (Device Sleep) mode (optional)

Hardware Features

Compliant with NVM Express specification 1.4
Compliant with PCI Express specification 4.0
Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
PCIe Gen 4 x4 interface
Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
Key components fortified by default with Corner Bond technology
30µ” PCB gold finger
Anti-sulfur technology implemented to prevent sulfurization in the environment
Power Shield (PS) to ensure data transfer integrity and minimize data corruption in the drive during an abnormal power outage
Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available

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